GLOBALFOUNDRIES Fabs in New York and Dresden Achieve “Ready for Equipment” Milestone
First tools installed in newly constructed cleanrooms to support leading-edge customer demand
MILPITAS, Calif.--(BUSINESS WIRE)-- Just over one year after revealing plans for a major global capacity expansion, GLOBALFOUNDRIES today announced its newly constructed cleanrooms in New York and Dresden are ready for the installation of 300mm semiconductor wafer fabrication equipment. Achieving “Ready for Equipment” (RFE) status marks the transition from the construction phase to the operations phase—a significant milestone on the path to volume manufacturing in these new facilities.
“At GLOBALFOUNDRIES, we continue to invest aggressively in driving sustained growth on advanced technologies,” said GLOBALFOUNDRIES CEO Ajit Manocha. “The build-out of our 300mm manufacturing campuses in New York and Dresden is supporting growing customer demand for advanced technologies, while creating hundreds of jobs and providing a significant boost to the economies in the surrounding regions. By completing these massive construction projects on schedule and on budget, we are continuing to deliver on our commitment to being the only truly global foundry.”
At Fab 1 in Dresden, Germany, GLOBALFOUNDRIES has completed construction of an additional wafer manufacturing facility designed to add capacity at 45nm and below, which has the potential to increase the overall output of the Fab 1 campus to 80,000 wafers per month once fully ramped. The expansion project will add more than 110,000 square feet of cleanroom space to the site and will allow Fab 1 to operate as one integrated cleanroom. This extension will make Dresden the largest wafer fab in Europe for leading-edge technology.
At Fab 8, GLOBALFOUNDRIES’ newest semiconductor manufacturing facility under construction at the Luther Forest Technology Campus in Saratoga County, New York, the RFE date was moved up by nearly two months to meet heavy customer demands. Last week, GLOBALFOUNDRIES moved into the facility’s Admin 1 office building and broke ground on the Admin 2 building. Once completed, Fab 8 will stand as the most technologically advanced wafer fab in the world and the largest leading-edge semiconductor foundry in the United States. When fully built-out and ramped, the total available cleanroom space will be approximately 300,000 square feet and will be capable of a total output of approximately 60,000 wafers per month. The total facility, including cleanroom support infrastructure and office space, includes approximately 1.9 million square feet of space and is expected to come online in 2012 with volume production targeted for early 2013. Fab 8 will focus on leading-edge manufacturing at 28nm and below.
GLOBALFOUNDRIES is the world’s first full-service semiconductor foundry with a truly global manufacturing and technology footprint. Launched in March 2009 through a partnership between AMD [NYSE: AMD] and the Advanced Technology Investment Company (ATIC), GLOBALFOUNDRIES provides a unique combination of advanced technology, manufacturing excellence and global operations. With the integration of Chartered in January 2010, GLOBALFOUNDRIES significantly expanded its capacity and ability to provide best-in-class foundry services from mainstream to the leading edge. GLOBALFOUNDRIES is headquartered in Silicon Valley with manufacturing operations in Singapore, Germany, and a new leading-edge fab under construction in Saratoga County, New York. These sites are supported by a global network of R&D, design enablement, and customer support in Singapore, China, Taiwan, Japan, the United States, Germany, and the United Kingdom. For more information on GLOBALFOUNDRIES, visit http://www.globalfoundries.com.
This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the U.S. Private Securities Litigation Reform Act of 1995 and include, without limitation, statements regarding the company's current expectations, assumptions, assessments, anticipations, objectives, plans, hopes, beliefs, intentions or strategies regarding the future. These forward-looking statements therefore are subject to risks and uncertainties which could cause actual results to differ materially. Some factors which contribute to these risks and uncertainties include the economic conditions both in the United States and around the world; the difficulties in developing new customers; the demand and supply outlook in the overall semiconductor / foundry industry; the sourcing strategy of potential customer base; competitor actions; the success of company technology alliances; construction progress on additional manufacturing facilities as well as associated governmental processes; the availability of components and equipment; labor and employment issues at manufacturing facilities; the progression of advances in technology and processes; and unforeseen events. The company has no duty to update any forward-looking statements in this release based on new information or events.
Jason Gorss, 518-305-9022
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